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× Lead-free solder joint
作者:Lederer, M.^1,2;Magnien, J.^1,2;Khatibi, G.^2;等
关键词:Constraining effects;Equilibrium state;...
会议举办机构:Materials Center Leoben, Forschung GmbH, Roseggerstrasse 12, Leoben
会议时间:2015
作者:Zhang, Liang^1,2, Liu, Zhi-Quan^2, Ji, Yu-Tong^3
关键词:Constitutive relations;Finite element simulations;...
会议举办机构:School of Mechanical and Electrical Engineering, Jiangsu Normal University, Xuzhou
会议时间:2016
3 Formation mechanism of pillar-shaped intermetallic compounds dispersed lead-free solder joint [会议论文]
作者:Nakata, Y.^1,2;Hashimoto, T.^1;Kurasawa, M.^1;等
关键词:Cross-sectional observations;Formation mechanism;...
会议举办机构:Calsonic Kansei, Co., Ltd., Global Technology Division, Sano, Tochigi
会议时间:2017
作者:Nabila, T.J.^1, Idris, S.R.A.^1, Ishak, M.^1
关键词:Continuous lasers;Heat distribution;...
会议举办机构:Faculty of Mechanical Engineering, Universiti Malaysia Pahang, Pekan, Pahang
会议时间:2017
5 Microstructure Evolution of Sn-3Ag-3Bi-3In/Cu Lead-free Solder Joints during Interval Aging [会议论文]
作者:Qu, Min^1;Cao, Tianze^1;Cui, Yan^1;等
关键词:Aging time;Diffusion control mechanisms;...
会议举办机构:School of Mechanical and Materials Engineering, North China University of Technology, Beijing
会议时间:2018
作者:Barbagallo, C.^1;Malgioglio, G.L.^2;Petrone, G.^1;等
关键词:Effective plastic strain;Electronic modules;...
会议举办机构:University of Catania, Department of Industrial Engineering, Viale A. Doria 6, Catania
会议时间:2017